AMD 7000 Series CPU Reveal Event At CES 2023

Advanced Packaging Technology made its debut at CES 2023.
Interesting Engineering

At this year's CES, AMD unveiled the world's first CPU+GPU integrated data center platform, the AMD 3D V-Cache. AMD hopes to remain the industry leader in cutting-edge packaging technology with this new chip.

An additional cache layer is stacked on top of a CPU using AMD 3D V-Cache packaging technology. Even though it appears complicated from an engineering standpoint, AMD's technology is simple to grasp.

In order to fit more functionality onto the chip, AMD is stacking the cache on top of the processor rather than next to it, as has been done in the past.

The new chip is the most complicated one ever made because it was made to improve desktop computers and servers. For this reason, the AMD 3D V-Cache should do well in the gaming and healthcare industries.

It will also be a godsend for notebook users who want the best performance possible.

It's a different way of arranging a processor, and because of improvements in how CPU manufacturers assemble parts on a chip, meaning AMD can now fit more cache without creating an overly large CPU.

But how and why?

To get to grips with the significance of this new chip, it is critical to understand what the cache is doing to comprehend why. The L3, or Level 3 cache, is the lowest level of your processor's three levels of cache. Each cache level is smaller and works faster.

It acts as a memory chain to your CPU and gives instructions as needed. Each cache level is smaller and works faster. It acts as a memory chain to your CPU and gives instructions as needed.

If you were to use the analogy of a supply chain, the L3 cache is like a regional distribution hub; your RAM is like a national warehouse, and so on through the L2 and L1 caches. With this new chip, you get more L3 cache for your money, the slowest level of your CPU when we talk about 3D V-Cache.

Though each cache layer is substantially faster than your hard drive or RAM, that is moderately slow.

The processor may stream and store more instructions if there is more L3 cache available, which reduces the number of times it must pull instructions from RAM. So, an additional L3 cache should significantly improve performance when the CPU must manage many instructions, such as playing video games or conducting complicated, memory-hungry processes like computer-aided design packages.

There are a few reasons AMD would want to create a whole chip solely dedicated to caching rather than increasing the CPU's internal cache, which has been the standard practice up until now.

To begin with, 3D V-Cache is more programmable and is an optional addition for processors that would truly profit from it. Although having a larger cache has uses outside gaming, many programs, including benchmarks like Cinebench R23, don't benefit from it.

The cache is another challenge for CPU production.

The process or node, which controls performance, power efficiency, and transistor density characteristics, is one of the crucial components in creating CPUs. Newer nodes' smaller physical transistors make more compact CPUs possible, but the cache is considerably harder to compress than other CPU parts like the cores.

Making a cache chip on an older, less expensive node may be more cost-effective because the cache doesn't benefit from being in cutting-edge nodes. The Ryzen 7 5800X3D is the only processor available right now that has a 3D V-Cache.

These ground-breaking AMD chips are changing how we think about data centers, gaming, and mobile computing applications. They provide exceptional performance and efficiency because of their innovative triplet architecture and 3D packaging, making them perfect for various applications and users.

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